Bittware’s XUPP3R PCIe card based on the Xilinx Virtex UltraScale+ VU9P FPGA has become really popular with customers. (See “BittWare’s UltraScale+ XUPP3R board and Atomic Rules IP run Intel’s DPDK over PCIe Gen3 x16 @ 150Gbps.”) That popularity has led to the inevitable question from BittWare’s customers: How about a bigger FPGA? Although physically, it’s easy to stick a bigger device on a big PCIe card, there’s an issue with heat—getting rid of it. To tackle this engineering problem, BittWare has developed an entirely new platform called “Viper” that employs computer-based thermal modeling, heat pipes, channeled airflow, and the new Xilinx “lidless” D2104 package to get heat out of the FPGA and into the cooling airstream of the PCIe card cage more efficiently. (For more information about the Xilinx lidless D2104 package, see “Mechanical and Thermal Design Guidelines for the UltraScale+ FPGA D2104 Lidless Flip-Chip Packages.”)
The first card to use the Viper platform is the BittWare XUPVV4.
BittWare’s XUPVV4 PCIe Card employs the company’s new Viper Platform with heat-pipe cooling for lidless FPGAs
Here are the specs for the BittWare XUPVV4:
- Xilinx Virtex UltraScale+ VU13P FPGA with 3.78M system logic cells; 12,288 DSP48E2 slices; 94.5Mbits of BRAM; and 360Mbits of UltraRAM. (Formally qualifies as a “bigger” FPGA. In fact, it’s currently the largest Virtex UltraScale+ FPGA in terms of programmable logic, DSP slices, and on-chip SRAM.)
- Four 100GbE QSFP optical module cages (also supports sixteen 10/25GbE modules)
- As much as 512Gbytes of DDR4 SDRAM
You should be able to build pretty much whatever you want with this board. So, if someone comes to you and says, “you’re gonna’ need a bigger FPGA,” take a look at the BittWare XUPVV4. Plug it into a server and accelerate something today.
via Xcell Daily Blog articles http://ift.tt/2fBJIws
June 29, 2017 at 07:03AM