PALTEK Data Brick packs Virtex UltraScale+ VU3P FPGA onto a PCIe card with four Samtec FireFly ports for multi-Gbps comms

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The new PALTEK DS-VU 3 P-PCIE Data Brick places a Xilinx Virtex UltraScale+ VU3P FPGA along with 8Gbytes of DDR4-2400 SDRAM, two VITA57.1 FMC connectors, and four Samtec FireFly Micro Flyover ports on one high-bandwidth, PCIe Gen3 with a x16 host connector. The card aims to provide FPGA-based hardware acceleration for applications including 2K/4K video processing, machine learning, big data analysis, financial analysis, and high-performance computing.

 

 

 

 

PALTEK Data Brick packs Virtex UltraScale+ VU3P FPGA onto a PCIe card

 

 

 

The Samtec Micro Flyover ports accept both ECUE copper twinax and ECUO optical cables. The ECUE twinax cables are for short-reach applications and have a throughput of 28Gbps per channel. The ECUO optical cables operate at a maximum data rate of 14Gbps per channel and are available with as many as 12 simplex or duplex channels (with 28Gbps optical channels in development at Samtec).

 

For broadcast video applications, PALTEK also offers companion 12G-SDI Rx and 12G-SDI-Tx cards that can break out eight 12G-SDI video channels from one FireFly connection.

 

Please contact PALTEK directly for more information about these products.

 

 

 

 For more information about the Samtec FireFly system, see:

 

• Samtec demonstrates 100Gbps over its optical FireFly Micro Flyover System using Virtex UltraScale FPGA for transmit/receive

 

• The synergy between FPGAs and optical interconnect for applications beyond networking and telecom

 

• More about the Samtec FireFly multi-Gbps optical interconnect system for high-speed backplanes in FPGA-based systems

 

• Samtec FireFly multi-Gbps interconnect system lets you choose between photons (100M) and electrons (28Gbps/channel)

 

 

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May 13, 2017 at 12:08AM