Memory choices abound and new Xilinx White Paper clarifies your options (DDR, HMC, HBM, BE2, Wide I/O, TCAM)

2014年10月30日 | By News | Filed in: News.

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The future of semiconductor memory will be rich in choices for system designers. If you’re looking for some clarification of those options, download a free copy of “The Rise of Serial Memory and the Future of DDR,” a new Xilinx White Paper (WP456) written by Tamara Schmitz and released just this week. The White Paper discusses the memory market trends, with DDR3 the clear market leader at the moment, and then discusses possible successors to DDR3 including:

 

  • Hybrid Memory Cube (HMC)
  • MoSys Bandwidth Engine 2 (BE2)
  • High Bandwidth Memory (HBM)
  • Ternary Content Addressable Memory (TCAM)

 

(Note: Xilinx UltraScale devices can control all of these memory types.)

 

 

 Market Trends for DRAM Memory 2014.jpg


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