3D Plus module puts Spartan-6 FPGA, mobile DDR SDRAM, and NOR Flash in a 19x19x3.9mm package

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The 3D Plus Fusio-II module uses 3D stacking to place four die—a Xilinx Spartan-6 XQ6SLX150T FPGA, two mobile DDR (mDDR) SDRAMs, and NOR Flash device—along with 167 bypass capacitors filtering 10 power supplies in a 19x19x3.9mm package. The module has a smaller pcb footprint than the Spartan-6 FPGA it incorporates—361mm² versus 937mm². Here’s a photo of the packaged device:

 

 

 

 

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