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根据台湾媒体DigiTimes报道,半导体公司安靠科技(Amkor Technology)和星科金朋(STATS ChipPAC)将同时负责苹果下一代iOS设备产品中使用的A8芯片封装,每家公司负责40%的订单。此外,日月光半导体(Advanced Semiconductor Engineering)将负责剩下的20%订单。


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